The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2002
Filed:
Sep. 03, 1999
Method for forming a metallic contact on an electronic printed circuit board and a product therefrom
Richard Hanson Jung, Park Ridge, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method for forming a metallic contact and manufacturing a product having an electronic component and a printed circuit board (PCB) includes dispensing a slurry solder paste mixture including a metallic powder and an acidic fluid , placing electronic component over solder paste dispensed over a surface area of PCB , and applying pressure on at least a section of electronic component such that at least a portion of slurry solder paste mixture dispensed on the surface area and in contact with the section of electronic component consolidates into at least one of an inter-metallic compound of hardened solder and a hardened alloy of solder forming the metallic contact between electronic component and said PCB