The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2002
Filed:
Mar. 05, 1998
Katsuji Matsuta, Sabae, JP;
Masahiko Kawaguchi, Takefu, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A method of manufacturing an electronic component secures sufficient area such that an element of the electronic component can be formed on the surface of a mother substrate while preventing debris from an insulating film from remaining on the element. According the method, individual elements are cut out from the mother substrate by cutting the mother substrate along cut lines A and B by using a dicing process wherein a protecting film is not located only at portions of the surface of the mother substrate where cut lines A and B intersect with each other and the surface of the mother substrate is exposed only at the intersection portions.