The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2002
Filed:
Sep. 17, 1997
Masayuki Iida, Kanagawa, JP;
Satofumi Koike, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
The present invention provides a liquid crystal display device which is capable of suppressing occurrence of an electric field between a metal light shielding layer and a metal interconnecting layer in a peripheral circuit portion, and preventing disconnection of the metal interconnecting layer due to corrosion, and which has improved reliability under conditions where light and heat are present. In the liquid crystal display device, a metal light shielding layer is formed in a pattern reverse to a metal interconnecting layer on the metal interconnecting layer on the driving substrate side. The potential of the metal light shielding layer is set to the same potential as the potential V of the metal interconnecting layer. On the metal light shielding layer is provided a transparent electrode through a flattening film. The transparent electrode is set to the same potential (=the potential of auxiliary capacity C ) as a counter electrode on the counter substrate side. Since no potential difference occurs between the metal light shielding layer and the metal interconnecting layer, even under conditions where water, impurities, light and heat are present, no chemical reaction (corrosion) takes place due to the occurrence of an electric field, thereby eliminating the possibility of disconnection of the metal interconnecting layer.