The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2002
Filed:
Jun. 26, 2000
Yeow Kwang Loh, Singapore, SG;
Gim Leong Tan, Singapore, SG;
Hock Chuan Koh, Singapore, SG;
Kah Shan Chen, Singapore, SG;
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A socket cover is mounted onto a socket for monitoring that an IC (integrated circuit) package is properly placed onto the socket with proper orientation and proper alignment. The socket cover includes a platform that is attached on top of the socket, and the platform has an opening for exposing pins of the socket when the platform is attached onto the top of the socket. The IC package is placed within the opening of the platform and onto the pins of the socket for testing of the IC package. A signal generator is disposed on a first side of the opening of the platform for emitting a signal across the opening toward a second side of the opening. A signal detector is disposed on the second side of the opening of the platform, and the signal detector is aligned with the signal generator such that the signal detector detects the signal emitted by the signal generator when the signal is not blocked. The signal detector detects the signal emitted by the signal generator when the IC package that is placed with proper orientation and proper alignment within the opening of the platform does not block the signal. Alternatively, the signal detector does not detect the signal emitted by the signal generator when the IC package that is placed with improper orientation or improper alignment within the opening of the platform does block the signal.