The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2002
Filed:
Feb. 16, 2000
Aaron Eugene Bond, Allentown, PA (US);
Marlin Wilbert Focht, Williams Township, County of Northampton, PA (US);
Agere Systems Guardian Corp., Orlando, FL (US);
Abstract
A bond pad having reduced capacitance is disclosed which is useful in fabricating integrated circuit and communications devices. The bond pad is disposed within a select bond pad area and comprises a ribbon of conductive material within the select pad area and a two-phased region of air and conductive material. Also, at least one interconnect area is disposed within the bond pad area. The ribbon is coupled to the two-phased region, and the interconnect is coupled to the ribbon and to the device. Inclusion of air within the bond pad structure reduces the capacitance of the device, while the surface area of the bonding pad is maintained to at least substantially retain the adhesive properties of the pad.