The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2002
Filed:
Jun. 28, 2000
Hiroyuki Hirai, Sagamihara, JP;
Yoshitaka Fukuoka, Hachioji, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
In order to obtain a semiconductor device of which bonding reliability between a semiconductor element and a printed wiring board is improved and a manufacturing method thereof, in a semiconductor device mounted a semiconductor element on a printed wiring board , while a circumference of a metal bump formed on a conductor pad electrode disposed on the printed wiring board in wiring pattern and an electrode disposed along an external periphery of a semiconductor element facing the metal bump is provided with, along a placement position of the metal bump or the electrode , frame- or wall-shaped anisotropic conductive film , a gap between the semiconductor element and the printed wiring board , the insides of the anisotropic conductive film formed in frame or wall shape, is filled by sealing material such as epoxy resin or the like.