The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2002
Filed:
Sep. 25, 2000
Robert Michael Reese, Philadelphia, PA (US);
Lockheed Martin Corporation, Bethesda, MD (US);
Abstract
A cooling arrangement useful for semiconductors or solid-state assemblages mounts the semiconductor or other solid-state device directly onto a first surface of a thermally conductive “heat spreader.” The heat spreader contains microchannels which open into coolant fluid ports on the second side of the heat spreader. The heat spreader, in turn, is mounted on a coolant fluid distribution or circulation plate. In one embodiment, the coolant fluid distribution plate also includes a micropump for circulating coolant fluid through the microchannels of the heat spreader. In another embodiment, the coolant fluid distribution plate simply distributes coolant applied to its fluid input port to those heat spreaders mounted thereon, and a plurality of coolant fluid distribution plates are mounted on a coolant fluid circulation plate, which uses a micropump to circulate coolant fluid to the various distribution plates and ultimately to the heat spreaders. Thus, coolant fluid is communicated directly into the support for the semiconductor chip or other solid-state device, for good heat transfer with low temperature drop.( )