The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2002
Filed:
Apr. 17, 2001
Applicant:
Inventor:
Hideo Matsumoto, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/312 ; H01L 2/313 ;
U.S. Cl.
CPC ...
H01L 2/312 ; H01L 2/313 ;
Abstract
Providing a semiconductor module comprising a plurality of semiconductor elements, in which wiring lengths of the semiconductor elements juxtaposed to each other are approximately the same. A semiconductor module comprising a lower layer substrate and an upper layer substrate, in which a first and a second electrode pads formed in a front surface of the lower layer substrate are connected with a first and a second wires by a first and a second bridge wires disposed in a back surface of the upper layer substrate.