The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2002
Filed:
Mar. 27, 2000
Applicant:
Inventor:
Yumi Saito, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/940 ;
Abstract
The present invention provides a novel metal interconnection structure for evaluation on electromigration thereof, wherein a test metal interconnection to be evaluated on electromigration is connected through a plurality of bamboo-structured metal interconnections to a plug metal interconnection, and the bamboo-structured metal interconnection has a smaller sectioned area than the test metal interconnection while the plug metal interconnection has a larger sectioned area than the test metal interconnection.
Saito, Yumi. (2002). Metal interconnection structure for evaluation on electromigration (U.S. Patent No. 6388269). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6388269
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile