The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2002

Filed:

Dec. 23, 1999
Applicant:
Inventors:

Osamu Nomura, Kanagawa-ken, JP;

Nobuyuki Yagi, Kanagawa-ken, JP;

Kozo Morita, Kanagawa-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 1/58 ;
U.S. Cl.
CPC ...
H01H 1/58 ;
Abstract

A substrate ( ), a first mold ( ) and a second mold ( ) are prepared, and a plurality of switch patterns ( ), ( ) are provided by providing openings (pattern-removal portions) (A) in such a manner that a pattern ( ), which has been formed on the surface of the substrate ( ), is divided into a plurality of patterns to form A switch substrate. Next, the switch substrate ( ) is clamped between the first mold ( ) and the second mold ( ). At such time, the side of the switch substrate ( ) provided with the switch patterns ( ), ( ) is brought into surface contact with an abutting surface ( ) of the first mold ( ) and, at the same time, a cavity ( ) provided in the second mold ( ) opposes the other side of the switch substrate. Next, a molten molding resin is charged into the cavity ( ) provided in the second mold ( ) to thereby fill the cavity ( ) and the openings (A) of the substrate with the molding resin. After the molding resin hardens, the first mold ( ) and the second mold ( ) are separated and the switch substrate ( ), which will have the molding resin case attached thereto, is extracted.


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