Manufacturing method for microlithography apparatus

Abstract

Methods are disclosed for decreasing the time and expense needed to design, develop, and manufacture a new or modified microlithography exposure apparatus, and for enabling the transfer precision of the various kinetic systems of the apparatus to be accurately estimated before having to actually fabricate and assemble the apparatus. The method comprises generating an overall computer-simulation model of the kinetic system of the apparatus. The model includes characteristic data (e.g., vibration transmission characteristics) of the mechanical assemblies comprising the kinetic system, the mechanical assemblies including the reticle and wafer stages as well as columns for supporting the stages. The model also includes characteristic data of the control system of the kinetic system. The model can be subjected to simulated testing and evaluation to determine the overall transfer precision of the kinetic systems, and improvements can be made to the overall model in response to the results of such testing and evaluation. After the model exhibits conformance to transfer-precision specifications, an actual apparatus according to the model can be built and evaluated.