The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2002
Filed:
Feb. 23, 2000
Shigeaki Tomonari, Osaka, JP;
Hitoshi Yoshida, Osaka, JP;
Masanao Kamakura, Osaka, JP;
Hiroshi Kawada, Osaka, JP;
Masaaki Saito, Osaka, JP;
Kazuhiro Nobutoki, Mie, JP;
Jun Ogihara, Osaka, JP;
Shuichi Nagao, Osaka, JP;
Matsushita Electric Works, Ltd., Osaka, JP;
Abstract
A flexible area is joined at one end via a thermal insulation area to a semiconductor substrate which becomes a frame and at an opposite end to a moving element . The thermal insulation area is made of a thermal insulation material a resin such as polyimide or a fluoridated resin. The flexible area is made up of a thin portion S and a thin film M different in thermal expansion coefficient. When a diffused resistor formed on the surface of the thin portion S is heated, the flexible area is displaced because of the thermal expansion difference between the thin portion S and the thin film M, and the moving element is displayed with respect to the semiconductor substrate