The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2002

Filed:

Dec. 10, 1999
Applicant:
Inventors:

Edgar R. Zuniga, Sherman, TX (US);

Samuel A. Ciani, Sherman, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract

An architecture and method of fabrication for an integrated circuit having a bond pad ; at least one portion of said integrated circuit disposed under said contact pad and electrically connected to said pad through a via ; a combination of a bondable metal layer , a stress-absorbing metal layer , and a mechanically strengthened, electrically insulating layer ; and said combination of layers separating said contact pad and said portion of said integrated circuit, and having sufficient thickness to protect said circuit from bonding impact.


Find Patent Forward Citations

Zuniga, Edgar. (2002). Bonding over integrated circuits (U.S. Patent No. 6384486). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6384486

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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