The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2002

Filed:

Aug. 23, 2000
Applicant:
Inventors:

Haruyasu Mizutani, Aichi, JP;

Yasuaki Tanaka, Aichi, JP;

Tadashi Yamamoto, Aichi, JP;

Chisato Masuya, Gifu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 5/300 ;
U.S. Cl.
CPC ...
C08L 5/300 ;
Abstract

The present invention is directed to a molded resin product and resin composition form making the same. The molded resin product includes at least one thick wall portion, at least one thin wall portion, and at least one thickness changing portion extending between the thick wall portion and the thin wall portion. The resin composition being used for forming the molded resin product includes 0.01-0.1 part by weight of a delustering agent and 100 parts by weight of blend components comprising: 30-50% by weight of a polypropylene block copolymer containing 4-20% by weight of ethylene, 0-10% by weight of polyethylene, 5-15% by weight of a propylene/butene copolymer, and 40-60% by weight of an ethylene/&agr;-olefin copolymer rubber.


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