The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2002
Filed:
Aug. 07, 1998
Applicant:
Inventors:
Akira Takashima, Kawasaki, JP;
Mitsutaka Sato, Kawasaki, JP;
Shinichirou Taniguchi, Satsuma-gun, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A method of manufacturing a semiconductor device which includes a semiconductor chip and a plastic package of a thermosetting polymer, including the steps of performing an ultraviolet cleaning process on the bottom surface of the semiconductor chip and, encapsulating the semiconductor chip through a molding process. The thermosetting polymer of the plastic package fully or partially covers the bottom surface of the semiconductor chip.