The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2002

Filed:

Aug. 18, 1999
Applicant:
Inventors:

Koji Nakashima, Dazaifu, JP;

Toyokazu Yoshino, Fukuoka, JP;

Shinobu Kamizuru, Kasuga, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 9/06 ;
U.S. Cl.
CPC ...
C25D 9/06 ;
Abstract

A method of manufacturing fine pattern of the invention comprises (a) a step of manufacturing a master substrate having a film of precious metal or an alloy thereof formed as an insoluble electrode on the electrode, (b) a step of forming a fine pattern film on the insoluble electrode with anion type electro-deposition, and (c) a step of exfoliating and transferring the fine pattern film onto another substrate. Another method of manufacturing fine pattern further includes a step of manufacturing a master substrate, of which a surface is provided with at least a repeatedly reproducible sacrificial electrode. Still another method of manufacturing fine pattern includes a step of forming a pattern electrode on a conductive substrate by electro-forming, and transferring the electrode onto another substrate. Yet another method of manufacturing fine pattern includes a structure wherein a transparent section is provided in a portion of a master substrate in order to facilitate a positional alignment. The invention provides reliable and accurate mass production of fine-line and high-density films of fine pattern having good transfer ability and durability at low cost. A fine-line and high-density printed circuit board can be made at low cost with the methods of manufacturing fine pattern as disclosed above.


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