The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2002
Filed:
Apr. 06, 2001
Kazumasa Igarashi, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
An epoxy resin composition for encapsulating a semiconductor device comprising as essential components (A) an epoxy resin; (B) a phenolic resin; (C) a curing accelerator; and (D) a hollow inorganic filler having an average particle size of 4 to 100 &mgr;m and an average shell thickness of 1.5 &mgr;m or more, wherein the amounts of the component (A) and the component (B) are adjusted such that a total amount of X and Y (X+Y) is 350 or more, wherein X is an epoxy equivalent of the epoxy resin (A), and Y is a hydroxyl group equivalent of the phenolic resin (B); and a semiconductor device comprising a semiconductor element encapsulated by the epoxy resin composition.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile