The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2002
Filed:
Jun. 30, 2000
Daniel P. Labzentis, Apalachin, NY (US);
Francesco F. Marconi, Hallstead, PA (US);
Allan R. Knoll, Endicott, NY (US);
David J. Bajkowski, Hallstead, PA (US);
International Flex Technologies, Inc., Endicott, NY (US);
Abstract
Disclosed is a method of producing a flexible circuit board having gold selectively plated on only desired elements of the conductive circuits. These desired elements typically are attachment sites, such as wire bond pads or ball grid array pads, for semiconductor chips. This method eliminates the requirement to buss all circuits to a common plating contact by using a background seed metal for plating continuity. This method also provides a means to alleviate the requirement for precise registration or alignment when multiple photoresist layers are employed in order to selectively plate only a portion of the metallic elements present on the flexible circuit board. The defect of resist lifting followed by nickel/gold underplating is eliminated by conditioning the intermediate photoresist to survive the nickel/gold plating bath.