The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2002

Filed:

Nov. 16, 2000
Applicant:
Inventors:

Koichi Warino, Tsukuba, JP;

Toshiyuki Ito, Tsukuba, JP;

Masahiro Suzuki, Tsukuba, JP;

Takao Hosokawa, Tsukuba, JP;

Assignee:

Kuraray Co., Ltd., Kurashiki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29D 1/100 ; B29C 4/500 ;
U.S. Cl.
CPC ...
B29D 1/100 ; B29C 4/500 ;
Abstract

A mold for producing a resin molded article. The mold comprises a molding cavity with a member having a recessed surface which defines the shape of the article being molded. Between the molding cavity wall and the member is a thin plate body having a heat capacity such that when a resin having a temperature higher than its transfer starting temperature is introduced into the recessed surface of the member, the resin near the recessed surface is cooled to a temperature lower than its transfer starting temperature, and then the temperature of the resin is increased to a temperature exceeding its transfer starting temperature after the resin fills the recessed surface.


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