The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2002
Filed:
Sep. 04, 1998
Jay DeAvis Baker, W. Bloomfield, MI (US);
Edward McLeskey, Waterford, MI (US);
Delin Li, Canton, MI (US);
Cuong Van Pham, Belleville, MI (US);
Robert Edward Belke, West Bloomfield, MI (US);
Vivek Amir Jairazbhoy, Farmington Hills, MI (US);
Thomas B Krautheim, Belleville, MI (US);
Mohan R. Paruchuri, Canton, MI (US);
Lakhi Nandlal Goenka, Ann Arbor, MI (US);
Jun Ming Hu, Canton, MI (US);
Visteon Global Technologies, Inc., Dearborn, MI (US);
Abstract
A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.