Conductor wires and semiconductor device using them

Abstract

The purpose of this invention is to provide a type of conductor wires which are appropriate for making a thin semiconductor device and can minimize problems of short-circuits between wires. This invention pertains to a type of conductor wires for electrically connecting a semiconductor chip to external conductors. According to this invention, each of conductor wires ( ) has first end portion ( ) bonded to electrode pad ( ) of semiconductor chip ( ), second end portion ( ) bonded to external conductor ( ), and bending point (A ) which is positioned between the aforementioned first and second end portions and is bent almost in the direction opposite to the direction that the conductor wire rises at the aforementioned first end portion. As the bending point is bent almost in the direction opposite to the rising direction of the conductor wire, the amount of rise of the conductor wire from the principal surface of the semiconductor chip can be reduced, and the thickness of the semiconductor device can be reduced. Also, by setting said conductor wires ( ), and wires ( ) of the conventional structure alternately, it is possible to ensure sufficient clearance between wires, so that it is possible to reduce the possibility of short-circuits among the conductor wires.