The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2002
Filed:
Jan. 06, 2000
Ming-Tung Shen, Taipei, TW;
Other;
Abstract
A semiconductor device of the present invention comprises a mounting substrate, a supporting substrate, a die and a plurality of electrical conductors. The mounting substrate including a first surface and a second surface opposite to the first surface on which electrical traces are disposed is formed with a receiving hole passing through the first surface and the second surface. The supporting substrate is made of a metal material and the shape of the supporting substrate being accommodated to the receiving hole of the mounting substrate, the supporting substrate received in the receiving hole of the mounting substrate to form at least one die receiving cavity between peripheral wall confining the receiving hole of the mounting substrate and the supporting substrate. The die includes a pad mounting surface provided with a plurality of bonding pads and are received in the die receiving cavity. The electrical conductors are electrically connected the bonding pads of the die with corresponding the electrical trace on the first surface of the mounting substrate.