The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2002

Filed:

Oct. 26, 2000
Applicant:
Inventors:

Shigenori Morita, Ibaraki, JP;

Yasuhito Ohwaki, Ibaraki, JP;

Tadao Ohkawa, Ibaraki, JP;

Toshihiko Omote, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/02 ;
U.S. Cl.
CPC ...
H05K 3/02 ;
Abstract

To provide a circuit board, having a circuit pattern of adequate high-frequency characteristics, for transmitting high-frequency electric signals at high speed, a circuit board, including a base layer formed of insulating material and a conductive layer formed on the base layer in the form of a specified circuit pattern, is so constructed that an air layer is made to lie between lines of wire of the circuit pattern or is so constructed that the lines of wire are covered with the cover layer but land portions of the base layer extending between the lines of wire are not covered with the cover layer. This construction of the invention enables dielectric constant between the lines of wire to be reduced and, as a result of this, the capacitance between the lines of wire can be reduced to provide improved high-frequency characteristics of the circuit pattern.


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