The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2002
Filed:
Sep. 22, 2000
Balamurugan Subramanian, Plano, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
An automatic recovery method for a Die Bonder Wafer Table in the event of loss of wafermap coordinate data is provided. If after moving to the first map die position and there is no die, the wafer table is moved back one die position in the direction of the track from the reference die to the first map die and then the closest coordinate from the map data of current bin in reverse direction is found and the table is moved to that position. If there is alignment fail or no die, the same step of moving back and finding the closest die coordinate from the map data in reverse direction and moving to that position is repeated. Otherwise, the next die coordinate from the map data of the current bin in reverse direction towards the first map die is found and the table is moved to this die coordinate position. The table is moved to the next die position in the forward direction if alignment fails or no die is encountered.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile