The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2002
Filed:
Dec. 23, 1999
Tomio Suzuki, Yokkaichi, JP;
Tadashi Otagiri, Nagoya, JP;
Satoru Kawai, Nagoya, JP;
Shuhei Ishikawa, Handa, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
A substrate material ( ) for printed circuit, comprising a sheet-shaped composite material ( ) composed of a plastic and a ceramic and conductive metal wires ( ) fixed in the composite material ( ) at given pitches, wherein the two surfaces of the substrate material ( ) have electrical connection to each other via the metal wires ( ). A process for producing a substrate material for printed circuit, which comprises stretching, in a mold, conductive metal wires at given pitches, then pouring, into the mold, a composite material composed of a plastic and a ceramic, curing the composite material, thereafter slicing the resulting material in a direction approximately perpendicular to the direction of the metal wires. Good electrical connection can be secured, and it is possible to prevent, during use, peeling between substrate material and conductive layers and between insulating material and metal wires. A printed circuit board of high density and excellent dimensional accuracy can be obtained.