The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2002
Filed:
Oct. 22, 1999
Christopher H. Raeder, Austin, TX (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A rotary chemical-mechanical polishing apparatus with multiple fluid-bearing platens for use in semiconductor fabrication is described together with a method for chemical-mechanical polishing of semiconductor substrates (“wafers”). A single polishing pad is affixed to a pad backing composed of a thin metal membrane. A polishing fluid is introduced onto an upper surface of the polishing pad. One or more wafers are held face down upon the upper surface of the polishing pad by carriers. Fluid-bearing platens are placed below a lower surface of the pad backing and located directly underneath each wafer. While polishing wafers, the polishing pad and pad backing are rotated about their common center, each carrier and wafer pair is rotated about its common center, the carriers apply a down force on the wafers, and the fluid-bearing platens support the pad backing. The fluid-bearing platens support the pad backing with a fluid flow that exerts a pressure on the pad backing. Within a single fluid-bearing platen, multiple zones of different fluid flow rates allow control of the polishing uniformity. Further, the fluid flow rate distribution of each fluid-bearing platen can be individually controlled.