The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2002
Filed:
Apr. 03, 2000
Kazunori Mune, Osaka, JP;
Kazuo Ouchi, Osaka, JP;
Satoshi Tanigawa, Osaka, JP;
Hirofumi Fujii, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
In a method for manufacturing an interposer for CSP and its intermediate body, a first insulating layer is formed on a cathode substrate. An opening is formed at a position in the insulating layer where a contact is to be formed so that the surface of the substrate is exposed to the inner bottom of the opening. The opening is filled with metal by the electroplating using the cathode substrate as a cathode to form a conductive path. A circuit pattern which is contact with the conductive path is formed on the insulating layer. The cathode substrate is removed partially or entirely so that the end surface of the conductive path is exposed to form a contact. This permits a variation of the heights of a plurality of contacts to be reduced.