The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2002

Filed:

Jun. 15, 2000
Applicant:
Inventors:

Hideyuki Ohtani, Aichi-gun, JP;

Fukuo Ishikawa, Kariya, JP;

Hideki Kabune, Chiryu, JP;

Hiroshi Hattori, Handa, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/02 ;
U.S. Cl.
CPC ...
H05K 7/02 ;
Abstract

Circuit elements of surface-mounting type such as MOSFETs etc. are mounted on a circuit board by soldering. The circuit board is retained slantingly by a base so that any one of the MOSFET falls out by its self-weight when the solder melts due to an abnormal heat generation of the MOSFET. The falling of the MOSFET is stopped by a stopper member, and then the MOSFET becomes in an electrically open state and retained at the stopped position in consequence of the subsequent cooling of the solder. Accordingly, even if one or more of the MOSFETs cause the abnormal heat generation, the continuous heat generation of the MOSFET is stopped and also the other circuit elements are prevented from being short-circuited.


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