The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2002
Filed:
Jan. 13, 2000
Applicant:
Inventor:
Yasunori Tanaka, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/02 ;
U.S. Cl.
CPC ...
H05K 7/02 ;
Abstract
There is provided a printed wiring board having upper and lower surfaces, including a resin layer formed in a predetermined region on the upper and/or lower surfaces, the resin layer integrally adhered to the printed wiring board and having a thickness sufficient to reinforce rigidity of the printed wiring board. For instance, when the printed wiring board includes an electric part having an exposed contact surface, on the upper and/or lower surfaces, the resin layer is not formed on the upper and/or lower surfaces. In accordance with the present invention, it is possible to reinforce a printed wiring board without an increase in weight.