The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2002

Filed:

Jan. 29, 1999
Applicant:
Inventors:

Hassan Hashemi, Laguna Niguel, CA (US);

Shiaw Chang, Thousand Oaks, CA (US);

Roger Forse, Santa Barbara, CA (US);

Evan McCarthy, Costa Mesa, CA (US);

Trang Trinh, Cypress, CA (US);

Thuy Tran, El Monte, CA (US);

Assignee:

Conexant Systems, Inc., Newport Beach, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/02 ;
U.S. Cl.
CPC ...
H05K 7/02 ;
Abstract

A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.


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