The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2002

Filed:

Jul. 13, 2000
Applicant:
Inventors:

Randy Thomas Heinrich, Dallas, TX (US);

Robert Joseph Roessler, Rockwall, TX (US);

David Leonard Stevens, Mesquite, TX (US);

Matthew Anthony Wilkowski, Mesquite, TX (US);

William Lonzo Woods, Kaufman, TX (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 2/708 ; H01F 5/00 ;
U.S. Cl.
CPC ...
H01F 2/708 ; H01F 5/00 ;
Abstract

An apparatus is disclosed for facilitating heat dissipation in an electrical device hat includes a core structure traversing a substrate when the core structure is in an installed orientation. The apparatus comprises: (a) at least one aperture through the substrate for accommodating traversing by the core structure; each respective aperture has periphery defined by a respective circumjacent face extending a height substantially equal with the substrate thickness; (b) a layer of thermally conductive material situated discontinuously on the circumjacent face of at least one respective aperture. The respective aperture is configured to establish a thermally conductive engagement with at least one facing portion of the core structure traversing the respective aperture in the installed orientation. The method comprises the steps of: (a) providing at least one aperture through the substrate for accommodating the traversing by the core structure; each respective aperture having a circumjacent face extending a height substantially equal with the substrate thickness; (b) providing a layer of thermally conductive material situated discontinuously on the circumjacent face of at least one respective aperture; and (c) assembling the electrical device in the installed orientation. The respective aperture is configured to establish a thermally conductive engagement with at least one facing portion of the core structure traversing the aperture in the installed orientation.


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