The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2002
Filed:
Jun. 08, 2000
Kazuaki Sumita, Gunma-ken, JP;
Kimitaka Kumagae, Gunma-ken, JP;
Miyuki Wakao, Gunma-ken, JP;
Toshio Shiobara, Gunma-ken, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
A sealing material comprising (A) a liquid epoxy resin, (B) a curing agent, (C) a copolymer obtained through addition reaction between an alkenyl group-containing epoxy resin and an SiH group-containing organopolysiloxane, (D) an inorganic filler having a specific surface area of less than 4 m /g, and (E) a fine inorganic filler having a specific surface area of at least 4 m /g and surface treated with an aminosilane or organosilazane compound is suitable for sealing flip-chip type semiconductor devices. Despite high loading of inorganic fillers, the material has a low viscosity in the low shear region and improved thin-film infiltration and forms a reliable seal.