The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2002
Filed:
Jan. 13, 2000
Melody G Hewitt-Bell, Kokomo, IN (US);
Steven Michael Stansberry, Elweood, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A process for preventing the formation of a copper precipitate in a copper-containing metallization on a die, wherein the process includes the steps of: identifying each manufacturing step after metallization which exposes the die to a temperature of greater than 100° C.; and after performing such post-metallization step, cooling the die down to a temperature of at least 100° C. at a cooling rate in a range of 0.6° C. per second to 1.0° C. per second, and more specifically in a range of 0.59° C. per second to 1.00° C. per second. The step of cooling the die can be achieved by utilizing any of numerous means including an air conditioning system with a thermocouple for monitoring the cooling rate, a substantially closed manufacturing environment housing having a ventilation port with an electrically operable fan system mounted proximate the ventilation port, a cooling rack having artificial ventilation, and/or a chiller plate.