The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2002
Filed:
Apr. 11, 2000
Applicant:
Inventor:
Muneyuki Matsumoto, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/14763 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/14763 ;
Abstract
A method of producing a semiconductor device having a connecting thin film for connection to a bonding wire on a bonding pad formed on a surface of a surface protective film. A recess is formed in the surface of the surface protective film. Thereafter, a metal deposited layer composed of a material for the bonding pad is formed, and a metal thin film composed of a material for the connecting thin film is further formed thereon. After the metal thin film is formed, unnecessary parts of the metal deposited layer and the metal thin film are removed by chemical mechanical polishing, for example.