The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2002
Filed:
May. 24, 1999
Shinji Fujita, Ohtsu, JP;
Masaki Sugimoto, Ohtsu, JP;
Shigeru Komeda, Ohtsu, JP;
Masazumi Iwanishi, Ohtsu, JP;
Masayoshi Satoh, Ohtsu, JP;
Chikao Morishige, Ohtsu, JP;
Kiyoshi Iseki, Ohtsu, JP;
Seiichiro Yokoyama, Ohtsu, JP;
Toyo Boseki Kabushiki Kaisha, Osaka, JP;
Abstract
A polyamide film satisfying (a) a haze value of not more than 5.0%, (b) a coefficient of kinetic friction (A) of not more than 1.0 under 50% humidity, the coefficient (A) being measured with regard to fiction between the same two polyamide films, and (c) a ratio of coefficients of kinetic friction (B)/(A) of not more than 1.5, the (B) being a coefficient of kinetic friction at 65% humidity, a billy oriented polyamide film showing an average dimensional change of not more than 3.0% and a difference between the smallest dimensional change and the largest dimensional change of not more than 2.0%, between before immersion in hot water at 95° C. and during the immersion, and an average dimensional change of not more than 4.0% and a difference between the smallest dimensional change and the largest dimensional change of not more than 2.0%, between the film without treatment and the film after withdrawal from said hot water; and a polyamide laminate film containing the film as a substrate layer. The films afforded by the present invention have superior properties and are industrially advantageous in a broad range of applications.