The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2002
Filed:
Jan. 05, 2000
Tomohiro Makigaki, Azusagawa-mura, JP;
Taro Takekoshi, Shiojiri, JP;
Masahiro Fujii, Shiojiri, JP;
Koji Kitahara, Ina, JP;
Seiichi Fujita, Suwa, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
When a nozzle with a stepwise cross-section, which is provided with a small cross-sectional nozzle portion formed on the front side thereof and with a large cross-sectional nozzle portion formed on the rear side thereof in a discharge direction, respectively, is formed by applying etching to a silicon wafer for forming a nozzle plate , a resist film is formed on a surface of the silicon wafer , and patterning by half-etching and patterning by full-etching is applied to the resist film . Next, anisotropic-dry-etching is applied to the silicon wafer by ICP discharge, thereby forming grooves at the full-etched portions. Next, the resist film at the half-etched portions is removed and anisotropic-dry-etching is applied to the portions from which the resist film is removed by ICP discharge. As a result, there can be simply formed on a monocrystalline silicon substrate an ink nozzle having a stepwise cross-section and further having an action, which is larger than that of a conventional ink nozzle, for aligning the directions of pressures applied from cavities to nozzles in a nozzle axis direction.