The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2002

Filed:

Dec. 29, 1999
Applicant:
Inventors:

Todd F. Miller, Phoenix, AZ (US);

Ronald P. Bieschke, Mesa, AZ (US);

Gary J. O'Brien, Ann Arbor, MI (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 3/102 ;
U.S. Cl.
CPC ...
G01R 3/102 ;
Abstract

An apparatus and method is disclosed for a semiconductor wafer front side pressure testing system ( ). Negative or positive pressure is applied to the top portion of a semiconductor wafer ( ) mounted on a support structure or wafer chuck ( ). In one embodiment, bellows ( ) coupled to the wafer chuck ( ) and a platen ( ) located above the semiconductor wafer ( ) provides a sealed atmosphere above the semiconductor wafer ( ) to permit negative or positive pressure to be introduced into this sealed atmosphere. In another embodiment, a seal is provided by a wall portion ( ) connected to the chuck ( ) contacting a gasket ( ) located beneath the platen ( ).


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