The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2002
Filed:
Oct. 06, 1999
Peggy L. Clark, Plantation, FL (US);
Motorola, Inc., Schaubmrug, IL (US);
Abstract
A layout for a ball grid array (BGA) device ( ) includes a set of solder ball pads ( ) and a set of interconnection vias ( ). Each one of said the set of interconnection vias ( ) is coupled to a corresponding one of the solder ball pads ( ). The interconnection vias ( ) are laid out such that they provide for increased room for both vertical and horizontal traces ( and ). With the BGA device ( ) divided by an X-axis and a Y-axis to form four quadrants, two other axes V and W, are established rotated 45 degrees from the X and Y axes respectively. The solder pads ( ) and interconnection vias ( ) are on laid out on lines along or parallel to the V and W axes. The interconnection vias ( ) in the four quadrants are located closer to the edge margins of the BGA device ( ) than their corresponding solder ball pads ( ).