The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2002
Filed:
Mar. 17, 2000
Applicant:
Inventors:
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/00 ;
U.S. Cl.
CPC ...
C08K 3/00 ;
Abstract
A composition comprising (A) a liquid epoxy resin, (B) spherical silica obtained by heating and burning spherical particles of polyorganosilsesquioxane, and (C) a curing accelerator is suitable as an underfill material for flip-chip type semiconductor devices. The composition has improved thin film infiltration and storage stability.
Ito, Kunio. (2002). Flip-chip type semiconductor device underfill (U.S. Patent No. 6372839). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6372839
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile