The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2002
Filed:
Aug. 24, 1998
Takashi Shigeno, Osaka, JP;
Osamu Isaki, Osaka, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A semiconductor device has a semiconductor chip fixedly mounted on an island and a bonding wire connecting a bonding pad on the semiconductor chip to a lead terminal whose end is positioned near the island. The semiconductor chip and the bonding wire are encased by a molded resin. The bonding wire includes a first extension ascending substantially vertically from the bonding pad, a second extension extending substantially horizontally from the first extension, and a third extension descending substantially vertically from the second extension. A bend between the second and third extensions is disposed outwardly of an end of the semiconductor chip.