The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2002
Filed:
Apr. 11, 2001
Michitaka Urushima, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
The semiconductor package is highly reliable and has a construction that enables an improvement of fabrication yield and that can greatly reduce the number of steps and the amount of time required for those steps. The semiconductor package has a construction in which wiring layer is supported by insulating film over a range corresponding to chip electrodes of semiconductor chip . In the fabrication of this semiconductor package, the semiconductor chip is mounted on an interposer constituted by the wiring layer , insulating film , and adhesive layer by inserting bumps into holes in adhesive layer , following which the metal junctions between wiring layer and all bumps as well as adhesion between semiconductor ship and wiring tape by means of adhesive layer are realized simultaneously by using a heater plate to apply heat to adhesive layer and inner lead connectors while pressing wiring tape across substantially the entire range of the chip electrode formation surface.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile