The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2002
Filed:
Oct. 19, 2000
Applicant:
Inventors:
Hans Göran Evald Martin, Delsbo, SE;
Per Ove Öhman, Uppsala, SE;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/166 ; H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/166 ; H01L 2/144 ;
Abstract
The present invention relates to a method of producing an electric, electronic, electromechanical and/or mechanical component ( ), where the component substrate is given a three-dimensional structure ( ″) or configuration, and where said substrate is adapted for further treatment or processing to form the component ( ). The substrate is formed by shaping said substrate against a die or mold, such as by molding, pressing, extruding or embossing said substrate, wherewith the precision necessary with respect to said component in the three-dimensional structure is achieved by means of a micromechanical working process when producing the die or mold.