The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2002
Filed:
Apr. 06, 1998
Applicant:
Inventors:
Keith W. Bailey, Mesa, AZ (US);
Sury N. Darbha, Tempe, AZ (US);
Prosanto K. Mukerji, Phoenix, AZ (US);
Gary R. Lorenzen, Phoenix, AZ (US);
Assignee:
Semiconductor Components Industries LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/166 ;
U.S. Cl.
CPC ...
H01L 2/166 ;
Abstract
A method of manufacturing semiconductor components ( ) includes assembling, packaging, and testing the semiconductor components ( ) while the semiconductor components ( ) are mounted on an adhesive layer ( ). The method of can also keep the semiconductor components ( ) mounted on the adhesive layer ( ) between each of the assembling, packaging, and testing steps.