The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2002

Filed:

Aug. 01, 2000
Applicant:
Inventors:

Milind Ganesh Weling, San Jose, CA (US);

Subhas Bothra, San Jose, CA (US);

Satyendra Sethi, Pleasanton, CA (US);

Assignee:

VLSI Technology, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/100 ;
U.S. Cl.
CPC ...
H01L 2/100 ;
Abstract

A system for repairable interconnect links using laser energy in a semiconductor integrated circuit die. The integrated circuit die is fabricated to include a plurality of interconnect links. At least a first and a second interconnect element are included in the integrated circuit die. The first and second interconnect elements are couple via an interconnect link. An anti-reflective layer is disposed on a surface above the interconnect link. The anti-reflective layer is configured to increase an amount of laser energy absorbed by the interconnect link in order to fuse the interconnect link, and thereby repair the integrated circuit die.


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