The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2002

Filed:

Apr. 18, 2000
Applicant:
Inventors:

Takashi Takagishi, Shizuoka, JP;

Hisashi Tsukamoto, Shizuoka, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/340 ;
U.S. Cl.
CPC ...
H01R 1/340 ;
Abstract

A rear cover for use in waterproof connectors and a process for forming a resilient sealing member molded in one piece in the rear cover are provided. The rear cover, in which an electric wire is inserted through a base wall, has a hollow holder pattern on an outer surface of the base wall and a molded-in resilient sealing member containing: a holder formed in the holder pattern; a sealing body extended from the holder, which protrudes toward an inner side of the base wall and has a through hole for the electric wire to pass therethrough; and a plurality of sealing lips formed around the through hole, wherein a portion of periphery of the holder pattern is notched to form a hollow of injection inlet for molding the resilient sealing member in one piece in the rear cover. Thus, the rear cover according to the present invention improves a property of mold releasing and maintenance of a mold. That is, a deformation and damage of the rear cover can be prevented, in addition, an action responding to wear of the mold is easily executed and a fin formation can be prevented.


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