The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2002
Filed:
Jul. 03, 2000
Sa-nguan Boochakorn, Bangkok, TH;
Somboon Rungsawang, Cupertino, CA (US);
Watcharin Pinlam, Pathumthanee, TH;
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A predetermined number of IC (integrated circuit) packages are transferred from a first IC package tube to a second IC package tube. A chosen IC package track has dimensions that fit to dimensions of each of the IC packages. The first IC package tube is placed on a first end of the chosen IC package track, and the second IC package tube is placed on a second end of the chosen IC package track. A stopper gate and a singulator are disposed above the chosen IC package track between the first end and the second end of the chosen IC package track. The first IC package tube, the chosen IC package track, and the second IC package tube are tilted to a slant with the first IC package tube being disposed toward a top of the slant and with the second IC package tube being disposed toward a bottom of the slant such that the IC packages slide out from the first IC package tube, down along the chosen IC package track, and toward the second IC package tube. The plurality of IC packages are lined up linearly against the stopper gate. A data processor controls the dropping down and the lifting up of the singulator and the stopper gate until the predetermined number of IC package are transferred to the second IC package tube. In another embodiment of the present invention, the chosen IC package track is part of a turret having a plurality of IC package tracks. Each IC package track has respective dimensions to fit to dimensions of a corresponding type of IC package. The length of the turret is disposed between the first IC package tube and the second IC package tube. The turret is rotated about the length of the turret until the chosen IC package track faces the stopper gate and the singulator.