The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2002

Filed:

Mar. 10, 1999
Applicant:
Inventor:

Harufumi Kobayashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/312 ; H01L 2/348 ; H01L 2/952 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/312 ; H01L 2/348 ; H01L 2/952 ; H01L 2/940 ;
Abstract

A semiconductor apparatus substrate according to the present invention has a substrate, a piece-substrate that has been punched out of the substrate and pushed back to the original position, an opening unit formed in a region of the substrate that substantially surrounds the piece-substrate, and a support unit installed inside the opening unit. As a result of this configuration, in transporting the semiconductor apparatus substrate after the piece-substrate has been pushed back, the piece-substrate is prevented from falling off the semiconductor apparatus substrate.


Find Patent Forward Citations

Kobayashi, Harufumi. (2002). Semiconductor substrate and manufacturing method thereof (U.S. Patent No. 6369440). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6369440

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…