The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2002
Filed:
Nov. 16, 1999
Applicant:
Inventor:
Günter Igel, Teningen, DE;
Assignee:
Micronas GmbH, Freiburg, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/984 ; H01L 2/996 ;
U.S. Cl.
CPC ...
H01L 2/984 ; H01L 2/996 ;
Abstract
A semiconductor component ( ) has a pressure sensor and a semiconductor chip ( ) with a semiconductor structure ( ) for at least one additional function of the semiconductor component ( ). The semiconductor chip ( ) is connected to a casing ( ) by means of an elastic carrier arrangement ( ) and can be deflected relative to the casing ( ) against the restoring force of the material of the carrier arrangement ( ) on the whole. For indirect measurement of a pressure acting on the semiconductor chip ( ) and causing the deflection of the semiconductor chip ( ), at least one position sensor that works together with the semiconductor chip ( ) is provided.