The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2002
Filed:
Jan. 11, 2001
Hideo Matsumoto, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor device including (a) a base plate, (b) an insulation substrate including of an insulator plate with a front electrode and a back electrode bonded thereon and fixed onto the base plate by the back electrode, (c) a semiconductor element fastened onto the insulation substrate by the front electrode, (d) an insulating cover covering the semiconductor element, and (e) electrodes that are led from the semiconductor element to the outside of the insulating cover. The back electrode is larger than the insulator plate, and the base plate has a through hole that is smaller than the back electrode and larger than the insulator plate. The insulation substrate is positioned in the through hole and is fastened onto the back surface of the base plate by the periphery of the back electrode. The insulation substrate can make direct contact with a heat sink without the base plate intervening therebetween, and thereby thermal resistance between the semiconductor element and the heat sink is decreased. Also, bending stress to be generated in the insulator plate when fastening the heat sink onto the base plate by screwing is mitigated by the back electrode, and thereby dielectric breakdown in the semiconductor device due to cracks in the insulator plate can be restrained from taking place.