The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2002
Filed:
Feb. 09, 2000
Applicant:
Inventors:
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/941 ; H01L 2/358 ;
U.S. Cl.
CPC ...
H01L 2/941 ; H01L 2/358 ;
Abstract
A semiconductor device has a semiconductor substrate, an internal circuit formed on the semiconductor substrate, a connection pad formed on the semiconductor substrate and connected to the internal circuit, and a test pad formed on the semiconductor substrate so as to be connected to the connection pad and used for functional testing of the internal circuit. The semiconductor substrate has a bonding region provided on the surface thereof so as to allow another semiconductor substrate to be superposed thereon by being bonded thereto, with the connection pad formed inside the bonding region and the test pad formed outside the bonding region.